DIAS红外测温仪DT40P

半导体制造硅片测温型DT40P

测温范围：300~1300°C ，400~1400°C

波长：3.43μm

主要应用：

1) 半导体制造硅片测温

2) 塑料薄膜（聚丁烯、聚苯乙烯、聚亚胺酯、乙烯基、尼龙）

德国DIAS红外测温仪塑料薄膜温度测量仪 半导体制造硅片测温型DT40P

性能指标

型号 DT40P

测温范围 300~1300°C

400~1400°C *

主要用途 半导体生产硅片测温，聚丁烯、聚苯乙烯、聚亚胺酯、乙烯基、尼龙类塑料薄膜

光谱范围 3.43µm

光学系数 300，800，1200

距离系数 约50:1

测量误差1 1.0%测量值或1 K

重复精度1 0.5%测量值或0.5 K 

NETD2 0.1°C

响应时间(t95) 150ms, 可调达100 s

发射率 0.200~1.000

瞄准 无*标注的为无瞄准(可选外置激光瞄准灯)， 有*标注的可选内置LED瞄准灯

可调参数 发射率, 响应时间, 温度单位°C或°F, 存储方式, 子测温范围, 可通过USB通信接口和软件调整

供货范围 DT40P,操作手册,安装螺母,检测单,Windows®下PYROSOFT Spot,连接电缆需单独订货

1经过黑体炉标定, Tamb=23°C, ε=1, t95=1s, 取大值 2噪声等温差.  3  *可选内置LED瞄准.

AP4580SM2PWMV6FV6

AP4650S2PWTW4TW4

AP3540S2PWMV4MV4

AP3550SM2PWTW4TW41.75

AP3657S2PWMV4FV4

AP4540S2PWTW6TW6

AP4657SM2PWMV6FV6

AP3657SM2PWMV4FV4VS

AP3625SM2PWTW4TW41.75BB

AP3625SM3PWDTW4TW4TW4.875BB

AP3540SM2PWFV4FV4PI

AP3650S2PWTW4TW4

AP3540SM2PWFV4FV4FS/10

AP3580SM2PWMV4FV4

AP3540SM3PWDTW4FV4TW4PI

AP4657SM2PWTW6TW6VS

AP3657SM2PWTW4TW41.75

AP3657SM2PWFV4FV4VS

AP3540S2PWTW4TW4

AP3550S2PWTW4TW41.75VS

AP4625S2PWMV4MV4

AP3650S2PWMV4MV4

AP4650S2PWMV4MV4

AP3540SM3PWDFV4FV4FV4PI

AP3540SM2PWMV4FV4

AP4540SM2PWMV6FV6

AP4625S2PWTW6TW6

AP4540S2PWFV4FV4

AP4550SM2PWMV4MV4

AP3540SM3PWDTW4FV4FV4PI

AP3657SM2PWTW4TW41.75VS

AP4625SM2PWMV6FV6

AP4540SM2PWTW4TW4

AP3550S2PWTW4TW4

82-008

AP3550S2PWTW4TW41.75

AP3550SM3PWJFV4FV4FV4

AP3540SM2PWMV4TW4PI

NB00022

NB00026

KJH04-06-X17

10-KQ2X08-10A

KB00708

22127

22075

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